The site launched with a focus on the wine and spirits industry and will expand into additional segments
19 Mar 2019

L&L exclusive: Avery Dennison launches M_use

Digital platform aims to inspire converters and designers

MPS, Esko, Cerm host Labels Connected
19 Mar 2019

MPS, Esko, Cerm host Labels Connected

Event to return in mid-2019 after successful first edition

DataLase launches certification scheme
19 Mar 2019

DataLase launches certification scheme

To help ensure implementation and application of laser reactive coatings

Sihl and partners present short-run inkjet packaging production
18 Mar 2019

Sihl presents Artysio

New video showcases short runs of packaging using aqueous inkjet

Windmöller & Hölscher build service and support network across Asia-Pacific
18 Mar 2019

W&H enhances presence in Asia-Pacific

New subsidiaries and local branches established across the region

15 Mar 2019

TLMI publishes matrix survey report

Industry Updates

First-of-its-kind report calculates converters’ annual matrix waste

15 Mar 2019

Parkside creates compostable pack for Two Birds

Industry Updates

Plastic-free, compostable flexible packaging eight years in development

14 Mar 2019

Lemu Group poised for expansion in North America

Industry Updates

New sales and marketing effort to be led by Andre Beaudoin

14 Mar 2019

UPM Raflatac details environmental initiatives

Signatory to New Plastics Economy Global Commitment

14 Mar 2019

Stora Enso joins New Plastics Economy initiative

Stora Enso has joined the New Plastics Economy Global Commitment

14 Mar 2019

WPO hosts packaging training in Jordan

Event was opportunity to understand needs of the Arab region

14 Mar 2019

L9 announces World Label Awards winners

All L9 international associations submitted entries to global contest

14 Mar 2019

Armor gets Industry of the Future Showcase award

For automation and digital transformation of its industrial facilities

14 Mar 2019

Mühlbauer, PragmatIC partner for FlexICs

Develop high speed bonding technology for FlexICs