Armor USA hosts first Technical Club event

Armor USA held its first Armor Technical Club near its US headquarters in October, attracting over 30 customers represented by 51 delegates. Attendees came from all over the US, Mexico and other parts of Latin America, including Argentina, Chile and Brazil.  

‘The main objective of the event was to bring tools to our customers which will help them differentiate their sales offer to their customers and bring new business during difficult economic times,’ said the company in a statement.  

Product presentations included Armor’s new SolFree process, debuted at Labelexpo Europe and due to be launched in the US in 2010.   

A guest speaker, industry specialist Harry Schofield, gave a presentation on the technical needs of the printer, receptor and ribbon in the wide range applications for the thermal transfer ribbon market. 

Click here for more stories about Armor on L&L.com.