Avery Dennison to host virtual Labelexpo booth

Labelexpo Americas 2014 takes place September 9-11 at the Donald E. Stephens Convention Center in Rosemont, Illinois. Read about Avery Dennison’s physical presence in the Labels & Labeling online show preview.

Using CAD drawings of the physical booth, the virtual booth replicates what will be seen at Labelexpo Americas 2014, including seven innovation zones that feature technology designed for unique segments and applications. Visitors can click on each innovation zone to access product overviews and educational information, including white papers, videos and product portfolios.

The virtual tradeshow will also have a live chat function that is staffed globally by Avery Dennison product specialists following Labelexpo Americas 2014 on September 16-17. After that time, virtual booth visitors will be able to submit questions directly to sales representatives and technical experts and quickly receive the information they need.

Judy Abelman, vice-president of communications for Avery Dennison Materials Group, said: ‘Our virtual tradeshow will open the door to converters around the world who are unable to attend the show.

‘This tool will enable them to experience the innovations we will debut and gain access to the information and tools featured in our booth. It’s also a great way for converters at the show to share what they’ve seen with team members who weren’t able to come to Chicago.’