Organized by AWA Alexander Watson Associates, the annual IMLCON and IMDCON Conference and Exhibition will take place in Chicago at the Hyatt Rosemont Hotel, October 4 to 5, 2012.
Market and technology trends
The conference agenda features a program of expert papers, commencing with a presentation from Clare Goldsberry of Modern Plastics Worldwide discussing what it will take to bring IML and IMD into the mainstream packaging and product decoration markets. The balance of the program investigates a variety of aspects of this broad-ranging subject.
Corey M Reardon, president and CEO of AWA provides an in-depth overview of the current status of the in-mold labeling market. Boa Technology, with its patented closure system for the sporting industry, is looking to use in-mold technology for these products, and product design engineer Eric Irwin delivers his project brief to the industry.
Dr Laura Bix of Michigan State University’s School of Packaging discusses the interaction between packaging and the consumer. Environmental consultancy Tickety Boo’s Mark Shayler delivers his vision of eco-design for packaging in the circular economy, while PwC’s Ian Murdoch discusses whether ‘sustainable packaging’ is a myth or a reality.
Bill Hewitt, Yupo USA, will introduce the key topic of retail shelf ‘stand out’ for product packaging, and how the many choices in IML materials and capabilities can enhance it.
In-mold technology challenges and opportunities
Mark Dirr of XTEN Industries charts the IML/IMD odyssey and the challenges it presents for designers, project managers, and processors, while Stephen Boyd of Systems Labelling introduces a recent breakthrough in removable in-mold labels, and Keith Bechard of Entropex, one of North America’s largest PP recyclers, demonstrates the value of such labels in the recycling arena.
Jes Gram of Gram Technology shows how – for both high- and low-volume projects – thin wall and barrier applications for IML are justifying the use of the technology in many new product areas. A competitive technology, direct-to-product inkjet, and its likely future in product identification and decoration, is also discussed in a paper from Clayton Sampson of Cyan Tec.
The program also includes a panel discussion, networking breaks, visits to the complementary exhibition, and a cocktail reception on the first evening courtesy of Platinum Event Sponsors Marbach.
Also sponsoring the event are Eastman, Illig, Yupo, and media in the plastics and packaging industries, including Converting Quarterly, Label & Narrow Web, PFFC, Plastics Decorating, and Plastics Today.
Full details of IMLCON & IMDCON 2012 are available via the AWA Alexander Watson Associates website, where it is also possible to register or book an exhibitor booth. End users can apply for complimentary event passes.