Stora Enso and NXP partner to develop intelligent packaging

The collaboration will also focus on brand protection and the development of tamper evidence applications, which will benefit both consumers and brand owners.

By using NXP RFID technology, such as near-field communication (NFC) and ultra-high frequency (UHF), Stora Enso will in the future have smart packages that can be easily tracked and traced through the entire supply chain, so providing full end-to-end transparency.

The integrated technology will also be able to detect if the intelligent package has been tampered with en route to the consumer and, once in the hands of the consumer, could provide additional information and interaction through an NFC-enabled smartphone.

Stora Enso said this visibility and insight is critical for brands and major manufacturers to ensure their products are being shipped and handled correctly. For consumers the benefits are two-fold as intelligent packaging will be able to verify the authenticity of a product and also provide care, usage and other important information via the NFC-enabled tag.

An Innovation Centre at Stora Enso’s head office in Helsinki, to be opened later this year, will support the development of intelligent packaging by offering a ‘stimulating space for customers seeking new ideas in packaging’. The focus will be on idea generation, design, new business development and incubation. The space is also designed to host product launches and will feature a prototype and sample laboratory.

Stora Enso chief executive officer Karl-Henrik Sundström sad: ‘The co-operation with NXP offers substantial business opportunities for Stora Enso. We have already worked on several concept cases with customers and partners within intelligent packaging. The co-operation with NXP will enable us to bring this development closer to market and provide faster scalability in intelligent paper and board solutions.’

Commercial activity at Stora Enso’s micro-fibrillated cellulose (MFC) pre-commercial production plant in Imatra, Finland started in early 2015. This is the world’s largest MFC facility and now provides raw material for selected commercial consumer boards enabling lighter weight packaging. The development of MFC is focused on source reduction and even more sustainable fiber-based packaging using less raw material, as well as barrier coating options for grease and oxygen. In the future, it could additionally provide biodegradable aluminum film replacement.

Ruediger Stroh, executive vice president and general manager of security and connectivity, and a member of the international board of management at NXP Semiconductors, added: ‘Our RFID technology in combination with Stora Enso’s packaging solutions creates additional value to both consumers and brand owners by providing information and insights along the complete supply chain.

‘The ability of the RFID tag to detect when a package has been compromised and also provide additional product information via NFC truly enables a unique, smart, engaging brand experience and is another example of how security can be broadly implemented to protect our everyday lives.’

Stora Enso has also established 'ambitious' financial targets for its five divisions as it looks to transition from a traditional paper and board producer to a customer-focused renewable materials company.

Intelligent packaging will be showcased within the Smart Packaging Lab at Labelexpo Euroe 2015.