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  • 14 Mar 2019

Mühlbauer and PragmatIC partner for high speed bonding of RFID inlays

Mühlbauer and PragmatIC partner for low-cost smart packaging

Mühlbauer has qualified its TAL15000 system for high speed bonding of PragmatIC flexible integrated circuits (FlexICs).

PragmatIC's FlexICs are said to offer a low-cost alternative to expensive silicon chips that are used in current RFID inlays. PragmatIC recently launched its first ConnectIC products focused on HF-RFID for smart packaging applications, including brand authentication and grey market avoidance.

Mühlbauer’s extensive experience in inlay assembly has enabled it to develop practical options for FlexIC bonding on the pick-and-place machines that comprise the industry’s largest installed base.

The companies have been working together since 2018 building on Mühlbauer’s extensive experience in inlay assembly to develop practical options for high speed bonding of FlexICs. The TAL15000 is described as the industry benchmark system for flip-chip RFID inlay production, with a throughput of up to 13,000 inlays per hour and a global installed base of more than 300 machines.

Qualification of the TAL15000 for FlexIC assembly enables manufacturers to leverage their existing installed base to deliver dramatically lower cost RFID inlays. Coupled with the thin, flexible and robust nature of FlexICs, this unlocks the potential to extend RFID technology into a much wider range of mass market opportunities, the companies stated.

Gerald Niklas, business development manager for automation at Mühlbauer, said: ‘We see PragmatIC’s innovative FlexICs as a key enabler for the adoption of RFID in mass market applications and we look forward to continuing our collaboration to deliver robust and durable RFID products at a fraction of current inlay costs.’

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