Delo has developed a specialist adhesive to fix RFID tag chips to a label substrate. Delomonopox AD268 epoxy resin is an anisotropic electrically conductive adhesive designed for tasks in the RFID industry as well as other electronic packaging applications.
‘Our adhesive has an improved resistance to humidity’, explained Jens Amarell, product manager RFID at Delo Industrial Adhesives. ‘This makes it the ideal solution to applications where reliability is important, such for example in railway tickets, passports or protection of high-quality products against plagiarism.’
Delomonopox AC268 is used in chip attach processes – especially in flip-chip applications – to bond chips measuring just 400 µm to defined positions on the RFID antenna. Delo’s tests have proved continuous electrical conductivity on customers’ substrates in storage tests at 85 deg C / 85 percent r. h.
A short curing time of six seconds at 190 deg C with a thermode allows up to 20,000 microchips to be bonded per hour on a flip-chip production system. The adhesive adheres well to a wide variety of flexible and rigid substrates including PET, polyimide, FR4, copper, aluminum and silver. Delo’s tests have included temperature shock tests, bending tests and storage in a climatic chamber.