Schobertechnologies participates in Labelexpo Southeast Asia 2025
Company promotes technology for cutting and stacking of in-mold labels at the show.

Schobertechnologies has confirmed its participation at Labelexpo Southeast Asia 2025. The company will promote technology for cutting and stacking of in-mold labels at the show.
Visitors are welcome to bring along samples, photos, drawings and specific projects to the booth.
The company will promote its rotary die-cutting and perforating module for processing multiple blisters in one sheet or as an individual package, made out of various materials, among all PVC and PET.
High-capacity rotary die-cutting module with high precision magnetic cylinder and quick lifting device, designed for web width up to 1000 mm and cylinder repeats up to 48in will also be featured.
Punching module with integrated slitter for the production of corner rounding for tea-tags and –bags will also be promoted at the show. The immediate length cut after punching enables a precise alignment of the punching profile.
Built-in and drop-in punching modules with new generation line hole punching tools and punch waste removal device designed to be integrated in almost every narrow web printing press will also be discussed.
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