Tageos launches FlexIC-based NFC inlay range

Tageos has launched two new NFC inlay product lines, EOS Lite and EOS Zero Lite, using Pragmatic Semiconductor's flexible NFC Connect PR1301 chip to deliver ultra-thin, low-carbon connectivity for smart packaging and label applications.

The first product in the range, the EOS-932 Zero Lite PR1301, is a paper-based NFC inlay designed for integration into paper packaging and labels, targeting mass market applications including consumer engagement, product authentication and brand protection. The paper-based antenna design supports recyclability and is compatible with high-volume manufacturing processes.

The PR1301 chip's ultra-thin, flexible format allows discreet integration into curved surfaces and packaging without altering its appearance, addressing cost, supply chain and sustainability barriers that have historically limited NFC adoption at item level. The inlays support smartphone interaction, enabling brands to embed digital product identity directly into packaging and connect consumers to product information, authentication and marketing channels.

'The new EOS Lite and EOS Zero Lite product lines are yet another example of our path to success, opening new possibilities for brands to connect to their customers through their products and the consumer's most personal device, the smartphone,' said Matthieu Picon, CEO of Tageos.

'Together, we are shaping a new era of smarter packaging, enabling direct consumer engagement with virtually any item to prove authenticity, deepen trust and unlock data-driven insights across the value chain,' noted David Moore, CEO of Pragmatic Semiconductor.

Prototype samples of the EOS-932 Zero Lite PR1301 will be available by end of Q2 2026 on request, with volume orders expected from Q3 2026.