Read later
  • 04 Jul 2019

AWA event to focus on in-mold technologies

Embracing in-mold labeling, in-mold product decoration and in-mold electronics, AWA Conferences & Events’ dedicated annual conference on in-mold technologies and markets – IMLCON IMDCON IMECON – takes place this year on September 5-6 in Chicago.

The 2019 theme of the event is ‘Collaboration, sustainability and new technologies’.   

The three concurrent tracks dedicated to IML, IMD and IME will enable delegates to explore the related technologies, markets and applications in depth. The event will feature a comprehensive program of presentations by leading industry experts. Topics will include the latest technologies, discussions on today’s industry issues, innovations, and up-to-date market intelligence.

The ever-broader content of what was originally the IMLCON conference, which first took place 23 years ago, reflects the growing market for in-mold technologies. 

Alternating annually between Europe and North America, IMLCON IMDCON IMECON 2019 is taking place at the Hyatt Rosemont Hotel in Chicago. In addition to the formal agenda, it features a table-top exhibition and networking opportunities. Registration is now open and may be booked online via the AWA website, where program details are also available.

ABOUT THE AUTHOR

The Labels & Labeling global editorial team covers every corner of the world from Europe and the Americas, to India, Asia, Southeast Asia and Australasia with all the latest news from the label and package printing market.

See author’s profile »