Bemis Company, a supplier of flexible packaging and pressure sensitive materials, has signed a joint development agreement with Thin Film Electronics to develop a Bemis Intelligent Packaging Platform.
The agreement will accelerate the commercial development of functional sensor labels manufactured from printed electronic technology made from Thin Film’s proprietary read/writable printed memory and program logic. When used with Bemis packaging, the line of ‘intelligent’ labels will monitor and record key physical properties and environmental data in packaged perishable products.
‘Intelligent packaging is an emerging technology with many potential intersections with Bemis’ flexible packaging and pressure sensitive materials business segments,’ said Henry Theisen, Bemis company president and chief executive officer. ‘Our agreement with Thin Film Electronics is an investment in technology that could eventually make printed electronics a component of every package we manufacture.’
The Bemis Intelligent Packaging Platform is expected to be commercially available in 2014.