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  • 09 Nov 2017

Xeikon qualifies Filmax IML films

Xeikon has certified substrates from South Korea's Filmax, a manufacturer of polypropylene films, for use with its dry toner process in order to meet increased market demands for container decoration.

Xeikon has certified the Filmax BML-S and BML-O films after thorough testing at Xeikon’s production facility in Belgium. BML-S has been developed to obtain a smooth surface on labels, even after the blow molding process. BML-O gives an ‘orange peel’ effect to the label after blow molding. Also certified is a clear blow mold and a metalized blow mold material in both high gloss and matte finishes. The films achieved high print quality standards on the Xeikon 3500 and Xeikon 3050 digital presses, running the Xeikon QA-IC toner.

The digital printing specialist has identified market demands for high-quality, value adding, full color graphics, and reduced delivery times for decorative containers.

Filip Weymans, vice president of marketing at Xeikon, commented: ‘We know our customers are always exploring new opportunities. As a trusted advisor we want to help them achieve that. With our market knowledge, digital printing expertise and key partnerships, we continuously expand the range of Xeikon qualitied substrates. Qualifying the substrates, we guarantee our customers they can confidentially print on new substrates while maintaining the same high-quality results. By running the tests, we provide them with all the assurance they need.

‘The newly qualified Filmax substrates will allow customers to strongly position themselves in the in-mold containers and injection in-mold segments.’

Xeikon and Filmax, a 40-year-old manufacturer of polypropylene films including qualified BOPP and CPP films, have been cooperating for more than four years to develop materials for its digital press portfolio.


The Labels & Labeling global editorial team covers Europe, North and Latin America, India, China and Australasia with all the latest news from the label and package printing market.

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