China's Brotech Graphics makes Labelexpo India debut with live converting demos

On the CDF 330, the company is demonstrating the functions of flexo, semi-rotary die-cutting, slitting and conveyor stacking on one compact non modular system. The CDF has features such as sheeting and conveyor stacking, while combining other required finishing processes.

The FS is a label slitting, rewinding and inspection system available in web widths of 340mm, 430mm and 530mm. It comes with a maximum unwind diameter of 700mm and maximum rewind diameter of 600mm. The equipment is capable of running at maximum mechanical speed of 200m/min.

Ramon Lee, Brotech managing director, said: ‘We are ready to bring our expertise and experience to the Indian market. Our machines are globally used for slitting, die-cutting, lamination, primer, UV varnishing, cold foil, flexo printing and inspection of pressure-sensitive labels, as well as ECL, RFID, IML, tickets and tags and booklet labels.’

Harveer Sahni, managing director of Weldon Celloplast and an exclusive agent of Brotech in India, as reported here, added: ‘All the live jobs printed by HP are being die-cut on Brotech machines on the show floor. Weldon now has a strategic product line for the label industry and we are positioned to give perfect machines and equipment from printing process to finishing.’