Emerson & Cuming announces Asia-Pacific expansion plans

Emerson & Cuming Microwave Products HK Ltd has announced the opening of its new Hong Kong operation, effective January 1, 2006. These expansion plans are expected to better position the company to increase its business presence in the Asia-Pacific region.

The sales and administration office, managed by Brent Ng, is at Unit 13, 23rd Floor, Seapower Tower, Concordia Plaza, No. 1 Science Museum Road, Tsim Sha Tsui East, Hong Kong; Tel: 852 2620 6389.

Emerson & Cuming Microwave Products, Inc. develop and manufacture ECCOSORB, microwave absorbing materials and anechoic chambers; ECCOSTOCK dielectric materials for low loss RF and microwave applications; ECCOSHIELD electrically conductive sheets, caulks, adhesives and coatings; and ECCOPAD, standard and custom solutions for read on metal and liquid technology.  Emerson & Cuming Microwave Products maintains manufacturing facilities in Randolph, Massachusetts (US) and Westerlo, Belgium.

For over 50 years, the company has produced materials and engineered solutions for the RFID, military and aerospace, automotive, wireless and satellite communication markets.