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  • 24 Jan 2020

AIPIA announces details of its North America event

The third AIPIA smart packaging summit comes to New York City area in June

The third annual AIPIA Smart Packaging Summit Americas will return to the Greater New York City area this June co-produced with BXP Magazine to provide a complete overview of disruptive packaging technologies and to show brand can commercialize them.

The conference, which was previously branded as the Active & Intelligent Packaging Summit, will take place at the Westin Jersey City Newport June 1 - 2, 2020 in Jersey City, NJ. It will feature two days of dynamic presentations that provide a complete overview of disruptive packaging technologies and how brand owners and marketers are already commercializing them for the strongest ROI.

The Summit is aimed directly at consumer-facing and retailer brands, as well as developers of packaging solutions to help them explore how the latest smart packaging technologies can reinvent and invigorate the entire value chain.

‘We are returning to the USA with an even bigger and better event, as the American and related markets need these technologies,’ said Eef de Ferrante, executive director of AIPIA, based in Utrecht, The Netherlands. ‘Brand owners flocked to the last World Congress in Amsterdam and were hungry to learn how Smart Packaging can give their brands a boost and meet the needs of new consumer priorities, as well as the new retail environment. It will be the same in the North America.’

Key topics will include blockchain, supply chain security, condition monitoring, authentication, inventory management, consumer engagement, food safety, reducing waste and brand protection. Additionally, AIPIA will discuss how smart packaging can contribute to the sustainability and helping brands to achieve zero waste targets.

‘The summit is the only North American event covering the entire smart packaging sector and offers a complete overview of where the market is now and, more importantly, where it is headed,’ added de Ferrante.

The 2020 program will include more than 20 expert speakers. A central feature will be the Packaging Innovation Challenge, in which major brand owners challenge AIPIA members to offer solutions for a specific objective. Previous challenges have been hosted by Bayer Consumer Health and Mondelēz International.

You can read more about the AIPIA World Congress, which took place in Amsterdam last year in the sixth issue of Labels & Labeling magazine. More information about the Smart Packaging Summit Americas is available on AIPIA website.


The Labels & Labeling global editorial team covers every corner of the world from Europe and the Americas, to India, Asia, Southeast Asia and Australasia with all the latest news from the label and package printing market.

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