ABG develops finishing options for new HP Indigo V12

The new ABG Digicon Series 3 modules are being developed especially for the newly announced HP Indigo V12 digital press, which runs at 120 meters per minute. All modules focus on automation, allowing for continuous production, whilst promoting quality and efficiency.

‘A key to ABG’s leadership in the print finishing market is our ongoing relationship with HP Indigo. With over 1,000 installations worldwide, our Digicon series has changed the face of print finishing,’ said Matt Burton, ABG’s sales director. ‘With these new modules, every part of our machine is built to increase efficiency, minimize downtime, reduce waste and guarantee superior results.’

The integrated modules will include auto die-cassette system that can load up to 10 die plates, keeping efficiency, high due to the automation of the die-loading and reducing downtime and unnecessary manual intervention. This module will also offer automatic pre-positioning of the die-cut, contributing to a substantial waste reduction.

ABG is also working on a unique buffer system and 100 percent print inspection; nonstop turret rewinding module with incorporated tension control system; advanced JDF/JMF technology enabling automatic make ready of new jobs with minimal human intervention thanks to scanners reading barcodes between jobs; and non-stop waste handling module with an automatic waste matrix extraction and collection.

The HP Indigo V12 digital press for labels is the first HP Indigo based on next-generation LEPx architecture. The press prints as fast as analog, creating new opportunities for label production.

‘ABG is the only print finishing equipment supplier offering this level of automation and sophistication. This innovation is helping our customers reach high levels of productivity for highly versatile job baskets with fast delivery and less waste,’ said Yogev Barak, head of strategy and business management at HP Indigo.

AB Graphic International will present its latest technological advancements exclusively to Dscoop members on May 12, 2020 via webinar.