Packaging Summit selected for 2007 World Packaging Conference

The World Packaging Organisation (WPO) announced it will hold its World Packaging Conference and WorldStar Ceremony in conjunction with the Packaging Summit 2007.

This will mark the first time in over a decade that the WPO has held its World Packaging Conference in the United States. WPO’s participation in the Packaging Summit furthers the organization’s overall purpose, which is to:

 Encourage the development of packaging technology, science, and engineering
 Contribute to the development of international trade
 Stimulate education and training in packaging

‘By participating in the Packaging Summit, the World Packaging Organization can extend its reach and mission to those attending this high-level packaging event,’ said Carl Olsmats, WPO general secretary. ‘The Packaging Summit is an ideal venue that provides a standard of excellence in the global packaging marketplace, which is central to WPO’s mission. We are very pleased to be part of this premier event.’

WPO will also have a presence at Packaging Summit 2006 with a booth in the expo’s Association Pavilion. The Packaging Summit 2006 is scheduled for May 16-18, 2006 at the Donald E. Stephens Convention Center in Rosemont, Illinois.