Avery Dennison integrates flexible NFC chip
Avery Dennison becomes the first to mass-produce NFC inlays using Pragmatic Semiconductor's flexible chip.
Avery Dennison has launched a flexible NFC inlay product line using Pragmatic Semiconductor's FlexIC technology, marking the first mass-scale integration of its kind to support digital brand experiences, authentication and Digital Product Passport compliance.
The new line, based on Pragmatic's NFC Connect PR1301, targets retail and healthcare markets with ultra-thin, flexible inlays produced through a manufacturing process that uses fewer chemicals, less energy and less water than traditional silicon chip production.
'NFC technology remains a key part of the digital infrastructure for many of our clients across the globe,' said Mathieu De Backer, VP of intelligent labels innovation at Avery Dennison. 'We are ready to mass produce products with Pragmatic NFC Connect, enabling us to further empower clients with reliable connectivity that supports consumer engagement and product authentication initiatives.'
James Davey, SVP of sales, business development and product management at Pragmatic Semiconductor, added: 'By seamlessly integrating NFC functionality into products and packaging, even on curved surfaces, brands can deliver smarter, more connected experiences and deeper consumer engagement at scale.'
The integration builds on a longstanding partnership between the two companies and extends Avery Dennison's intelligent labels portfolio into new markets.
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