Labelexpo to showcase active and intelligent labels and packaging

Labelexpo Europe 2015 is to play host to the Smart Packaging Lab feature area where attendees to the show will be able to discover the label and packaging technology of tomorrow.

Labelexpo Europe 2015 puts spotlight on technology of tomorrow

Smart packaging is already beginning to drive consumer demand and influence purchasing decisions while transforming the retail experience and stock management processes, and Labelexpo Europe 2015 will include a roundup of the latest advances in substrates, inks, digital systems and printing relevant to this area. This will include augmented reality systems, radio frequency identification (RFID) and near-field communication (NFC) smart tags alongside anti-bacterial films that prevent label contamination.

Avery Dennison will feature RFID technology from its Retail Branding and Information Solutions (RBIS) business, and will feature FiberTracker, an anti-counterfeiting labeling system which features a paper facestock with unique fiber patterns that can be scanned at point of purchase to validate product authenticity. The company will also demonstrate the capabilities of DirectLink, which uses NFC technology to deliver special offers, videos, and product information, and a printed electronic label that highlights time, temperature and tracking information to ensure compliance of product handling.

Taghleef Industries will be promoting Derprosa Bacterstop’s range of anti-bacterial BOPP films for food contamination prevention applications. The BOPP films are treated on one side with either matte or gloss with anti-bacterial properties, while the other side is corona treated for printing and laminating. Applications include pressure-sensitive, roll-fed wrap around and in-mold labels.

Blippar will showcase its app-based system that will allow visitors to Labelexpo Europe 2015 to scan (“blip”) objects in the Smart Packaging Lab that they’re curious about and access additional information, while EyeSee will demonstrate its eye tracking and facial coding technology.

Seido Systems will be showcasing the latest in 3D technology for package printing. From individual designer through product development collaboration to the manufacturing department, Seido Systems and Stratasys offers FDM and PolyJet 3D printers. Stratasys will bring Fortus and Polyjet machines to the exhibition.

And Systec, a German manufacturer of cylinder and flatbed screen printing and slitting equipment, will be displaying various techniques for printing flexible printed circuits for labels and electronic devices. These techniques will include via hole printing and contact drying for effectively printing and drying a variety of conductive inks.

Lisa Milburn, managing director of Labelexpo Global Series, said: ‘The whole smart packaging section of the market is rapidly developing and continuously evolving. It is being driven and influenced by many external factors such as brand owners trying to leverage consumer loyalty, the desire and need to improve efficiency in the retail chain and the need to protect against anti-counterfeiting. Smart packaging is here to stay and is impacting on all major industries so this feature area will give a taste of the many technologies out there and how they can be applied from food and drink, to pharmaceutical, to automotive products and beyond.’

Smart Packaging Lab is one of a number of features spread across the show floor, including the Packprint Workshop and Linerless Trail.

A recent webinar detailed key themes and industry trends that will be visible at Labelexpo Europe 2015, and which can be accessed here to watch at any time before the show.

Labelexpo Europe 2015 takes place September 29 to October 2 in Brussels, Belgium.

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