Tageos showcases RFID, NFC and BLE portfolio at Loupe

Tageos has confirmed it will present its portfolio of RAIN RFID, NFC and Bluetooth Low Energy inlays and tags at Loupe Americas 2026 in Chicago.

The offering is targeting label and packaging converters, printers and brand owners building connected and smart packaging for applications including apparel, cosmetics, wines and spirits, consumer electronics, luxury goods, healthcare and sporting goods.

A key highlight is the EOS-932 Zero Lite PR1301, described as the world's first FlexIC-based NFC inlay, developed in collaboration with Pragmatic Semiconductor. The product combines a paper substrate antenna with ultra-thin flexible integrated circuit technology, enabling integration into paper labels and packaging while reducing plastic content and improving recyclability.

The broader Tageos portfolio covers traceability, inventory accuracy, product authentication and consumer engagement applications across the full product lifecycle.

'Our portfolio gives converters access to proven, high-quality inlays and tags that can improve inventory visibility and product authentication, enable consumer engagement, and provide connected packaging experiences allowing customers to differentiate offerings and unlock new growth opportunities,' said Jeremy Wade, vice president of sales Americas at Tageos.