AIPIA holds first congress

The Active and Intelligent Packaging Industry Association (AIPIA) has reported its first congress in Tokyo was ‘an excellent first step’, with delegates giving the event a ‘very positive rating’.

The first day of presentations, hosted by the Japan Packaging Institute, was devoted to an insight into the packaging scene in Japan and what is driving packaging development in Asian markets generally. This was followed by a tour of a supermarket and major retail outlet to discover how things look on shelf and what consumers in Japan expect from their packaging.

Day two had a full day of presentations from leading active and intelligent packaging experts, covering the introduction of low cost electronic functionality into packaging; how to use RFID in the supply chain; time-temperature indicators; printed intelligence technologies; NFC and consumer acceptance of contactless cards and smart phones; interactive packaging for marketing; innovative sustainable materials; and security features for high value goods.

The day concluded with a live demonstration by Smartrac of the potential for RFID/ NFC in both mobile commerce and for anti-counterfeiting and security measures.

Day three was taken up with a tour of the Tokyo Pack exhibition to see actual examples of A&IP on more than 30 stands.

AIPIA announced plans are already underway for the next meeting, which will be in Europe during the second half of 2013.

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