AWA linerless conference heads to Chicago
Two-day event covers automation, direct thermal innovation and 2030 materials outlook.
The AWA International Linerless Label Conference and Exhibition will take place in Chicago on November 19-20, 2026, bringing together linerless label manufacturers, converters and materials suppliers for two days of sessions on market developments, sustainability and the future of linerless label construction.
Confirmed sessions include a presentation by ETI Converting on automation, efficiency and innovation in linerless manufacturing, a session from Iconex and Appvion covering innovations in direct thermal media and intelligent labeling beyond traditional linerless applications, and a panel discussion titled Linerless 2030: Materials, Sustainability and the Next Generation of Label Construction.
The Linerless 2030 panel will feature Keith Nagle, east region commercial manager at Flint Group Packaging Solutions, Linnea Keen, strategic sales director at Appvion, Mark Brooks, linerless sales manager at UPM Self Adhesive Materials, and Andrew Knutson, manager of business solutions at Mondi.
Registration is open via the AWA website.
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