Making Packaging Smarter at Labelexpo

As part of the growing series of global Labelexpo events, Smart Packaging 2004 is being launched alongside Labelexpo Americas 2004, and will take place next year on 14-15 September at the Donald E. Stephens Convention Center in Chicago, Illinois, USA.

Developed in co-operation with the Institute of Packaging Professionals (IOPP), the two-day keynote conference will cover all aspects of smart packaging and is expected to attract in excess of 200 delegates from the label, packaging and end user sectors. Delegates will also be able to visit Labelexpo Americas 2004 and see the latest smart label and smart packaging solutions exhibited by some of industry’s key suppliers. In addition, the event will be supported by the Tag and Label Manufacturers Institute (TLMI).

Four conference sessions are planned for the two days of Smart Packaging 2004. Session 1 will include papers presented by leading brand owners/end users in the food/supermarket, drugs, drinks, cosmetics/toiletries and household/consumer products sectors - highlighting and reviewing their requirements for smarter and more intelligent packaging.

Session 2 will review pack protection requirements and solutions ranging from counterfeit deterrence, retail theft and tamper resistance, and will include case histories and technology solutions - as well as breakout meetings by key user sector.

Session 3 will examine the need for pack authentication and verification requirements and the ways that these can be provided, including solutions to prove goods/packs are genuine, to verify actions have been taken i.e. proof of sterilisation, and to identify packaging line or end user problems, e.g. colour change labels to indicate changes in chill or freezer cabinets. Case histories will also be presented, with the opportunity for further break out discussions.

Session 4 will assess current pack requirements and solutions in the fields of logistics, handling and storage, and supply chain management - including RFID, smart labels, chipless labels, etc. Both technical papers and case histories will be presented, with incorporated break out and feedback discussions.

Tom Schneider, President, Institute of Packaging Professionals, said, “Smart Packaging 2004 will give attendees the opportunity to learn about developments in this important and fast growing area of labels & product decoration, that presents major challenges to global brands and significant opportunities for the labelling industry. IOPP is delighted to be part of this new initiative.”

Roger Pellow, Labelexpo Managing Director, said, “According to Reuters Business Insight, 75% of respondents from the Food and Drink Industry Survey believe that technologies associated with all forms of ‘smart’ packaging will play an important part of the packaging industry by 2007. We are very excited about extending Labelexpo to address these issues.”