B-stageable dielectric adhesive from Emerson & Cuming

A new B-stageable dielectric adhesive from Emerson & Cuming enables the decoupling of the dispense and the assembly process. Emerson & Cuming’s E-1470 can be dispensed (as required for your application), B-staged, and stored for up to three months prior to cure. The psuedoplastic properties of the wet paste adhesive prevent slumping prior to or during the b-stage process.  Following B-stage, the material can be cured in just 5 minutes at 180C. Emerson & Cuming’s E-1470 has excellent adhesion to difficult to bond substrates, especially LCP, Ceramic and Gold.  Further, E-1470 forms an excellent lid seal and it is capable of passing gross leak. 

This unique technology helps address the application challenges associated with wet adhesives, small or complex parts, long cure times and adhesion challenges. Further, Emerson & Cuming’s E-1470 offers an opportunity for component manufacturers and sub-contractors to add additional value to their products by pre-applying the adhesive.