Emerson & Cuming’s reworkable CSP underfill is jet dispensable for fast and flexible manufacturing

Emerson & Cuming has introduced a new, jet dispensable solution in underfill technology, XE-1218.  This product is a snap cure, ultra fast flow, and reworkable epoxy.  XE-1218 is a reworkable capillary flow underfill for Chip Scale Packages (CSP) and Ball Grid Arrays (BGA) devices.  The XE-1218 will improve the attachment strength of CSP and BGA assemblies during thermal and mechanical shock, such as drop or bend testing and has ‘excellent’ thermal reliability, says the company. It is designed for high volume assembly operations using syringe or jet dispensing that requires an underfill that flows ultra fast and snap cures in-line. The XE-1218 is specially formulated to allow easy rework of components after underfill cure. This material has a viscosity of 1,400 centipoises and a work time of up to ten days at room temperature. It cures as fast as four minutes at 110oC and even faster at high temperatures.