Mhlbauer launches next generation of flip chip die sorter DS 15000

The Muehlbauer technology group, international and independent consultant and manufacturer of innovative security solutions, has announced the launch of the next generation of high speed flip chip die sorter DS 15000 at Semicon Singapore.

The DS 15000 is designed for high speed sorting of dice from wafer into carrier tape, surf tape or punched tape. This flexible solution is claimed to offer the full flip chip capability with a throughput of up to 15,000 uph including flip and full inspection time.

The company said in a statement: ‘Fully inspection of die front- and back-side and complete wafer mapping capability guarantee highest output quality. Handling of up to 12” wafers with optimized placement accuracy as well as small die handling down to 0.5 mm are only some features of this high quality solution. To increase the real production time of the system it is possible to integrate a second index track to minimize material changeover time as well as quality control e.g. sealing test. ‘