VPF launches polyimide adhesive material

VPF has launched a polyimide adhesive material designed for demanding industrial applications, including printed circuit board marking, where thermal stress and intensive cleaning processes are common.

The product, VPF item 630900-1001-801, features a 50-micron polyimide base film with a 20-micron white silk-matt coating optimized for thermal transfer printing of 1D/2D codes, serial numbers and variable data. The VPF high-performance acrylate adhesive 801 bonds reliably to printed circuit boards, and a white standard glassine liner is used. The material is temperature-stable up to 300°C for short periods, making it suitable for common soldering processes, and offers resistance to aggressive cleaning agents.

The material is available from 200m2 with a working width of 1,000mm, targeting electronics manufacturing, mechatronics and component marking sectors. Narrow rolls in 170mm widths and 400 running meters are also available on request, allowing smaller orders to be fulfilled more efficiently.

The Sprockhövel-based company says the product offers a competitive price-performance ratio alongside a low minimum purchase quantity. Other thicknesses and colors are available on request, and the material is available immediately.