AIPIA to host connected packaging webinar

The Active & Intelligent Packaging Industry Association (AIPIA) has announced a Connected Packaging Webinar focusing on market intelligence, regulatory readiness and digital engagement as connected packaging adoption accelerates.

The program brings together market intelligence, real-world use cases and expert discussions on technologies driving smart packaging adoption. The webinar focuses on four major forces accelerating connected packaging adoption in 2026.

Smart packaging market intelligence will cover 2026 market size, growth signals and opportunities through a data-driven overview of the global smart packaging landscape, highlighting key growth drivers, emerging technologies and investment opportunities across connected packaging.

Connected consumer experience sessions will examine how packaging is becoming a digital touchpoint, enabling direct engagement, personalization, authentication and real-time insights that strengthen brand-consumer relationships.

Digital Product Passport coverage will address what brands need to prepare for upcoming regulatory requirements and how connected packaging technologies support transparency, traceability, sustainability reporting and compliance.

RFID innovation and ambient IoT discussions will explore how advancements in RFID and emerging ambient IoT standards are transforming product visibility, supply chain intelligence and data-driven decision-making.

James Bevan, director at Vandagraf International, will present on connected packaging market insights. Catalina Steenbakkers Galindo, team lead market intelligence and business insights at AWA Alexander Watson Associates, will deliver the AWA RFID Market Outlook 2026.

The program includes a fireside chat on AI packaging data ownership featuring Charles Reardon, finance and strategy associate at AWA Alexander Watson Associates, and Steve Statler, chief executive officer at Ambient Chat AI.

Registration details and the complete agenda are available through AIPIA channels.