Smart packaging congress heads to Amsterdam

The AIPIA & AWA Smart Packaging World Congress 2026 will take place on 20-21 May in Amsterdam, bringing together brand owners, technology providers and packaging experts to address the shift from smart packaging pilots to real-world, scalable deployment.

The two-day event will cover the EU Digital Product Passport, GS1 2D Barcode adoption, supply chain traceability, food waste reduction and connected packaging for consumer engagement. Sessions are structured across three tracks: Connected Brands & Consumer Experience, Sustainability & Circular Innovation, and Supply Chain Intelligence & Data Management.

A key feature of the congress is the Brand Challenge 2026, a live on-stage hackathon in which a brand presents a real packaging challenge and technology providers respond in real time. The event is supported by Dracula Technologies, Identiv, Markem-Imaje, ETI Converting and Toppan.

'As regulation, data transparency and sustainability requirements accelerate, the congress is designed as a working event for brand owners and their suppliers,' the organizers noted, adding that the 2026 edition aims to deliver practical direction at a critical moment for the packaging industry.

Further information is available online.