High volume RFID strap production from Muehlbauer

The FCM 20000 from the Muehlbauer Technology Group is said to provide an efficient and flexible system for high volume RFID smart label strap production.

The new fully automated high speed line is especially designed to meet the demands of chip manufacturers or strap users in mass production with a maximum throughput of up to 20,000 UPH. Its wafer mapping capability speeds up the production process, as immediately only good dies are used for the assembly process. The flexibility of handling all chip types and sizes from 0.4 x 0.4 mm to 3.0 x 3.0 mm on wafers with formats of up to 12 inches, the proven ACP/NCP assembly process and the high final bond accuracy of 40 m, guarantee highest yield and thus, lowest possible strap costs.

The FCM 20000 concept includes high class testing for high product quality. This is realized by an integrated electrical test as well as a marking unit. Thereby the die itself as well as the functionality of the complete strap is controlled.

As the FCM 20000 is able to produce in a multi-row process, there is an additionally system available, which slits the strap tapes into a maximum of 12 rows, directly linked to the FCM 20000. A specific hot melt slitting and lamination process is also available in separate equipment, called ISL 250.

Together, both systems form a turnkey solution for easy and efficient strap production with best price/performance ratio.