Sun Chemical introduces new solvent-free adhesive

Sun Chemical has launched a new SunLam solvent-free ultra-low monomer (ULM) adhesive, designed for packaging producers seeking high-performance applications that offer a sustainable alternative to solvent-based adhesives.
 
Officially titled SunLam QA-8000+HA450, the new adhesive is part of Sun Chemical’s proprietary ULM technology. The adhesive extends its capabilities to meet the needs of flexible packaging manufacturers producing high-end applications such as extended boiling-pasteurisation, hot-filling, low-retort packaging and products that require improved chemical resistance in acidic or alcoholic environments.
 
Engineered for high-performance applications, the new product helps reduce energy consumption and CO2 emissions, as its VOC-free formulation has no drying requirements on a laminator. It supports lightweighting and facilitates mechanical recyclability for mono-material packaging thanks to a lower coating weight compared to solvent-based technology. It offers easy processing and fast bond strength development, and it features a high level of thermal resistance and lay-down on printed substrates.
 
SunLam QA-8000+HA450 has been fully tested in combination with Sun Chemical’s full polyurethane (PU) solvent-based inks technology and also works seamlessly with Sun Chemical’s Aqualam water-based inks to ensure compatibility for retort applications.
 
Nicolas Bétin, director of product strategy EMEA, packaging inks & materials, commented: 'We’re delighted to launch SunLam QA-8000+HA450, which offers packaging producers an energy-efficient alternative that delivers the performance required for high-end packaging. This product underscores our commitment to providing customers with a portfolio that balances efficiency and safety with sustainability demands. At Sun Chemical, we are proud to offer a range of full PU and non-solvent technologies for adhesive and ink solutions.'