Smart Packaging World Congress to return

The AIPIA & AWA Smart Packaging World Congress 2027 will take place June 17-18, 2027, in Amsterdam.
 
The AIPIA & AWA World Congress brings together global innovators, brand owners and businesses to explore technology.

In 2027, the event will host interactive, live demonstrations, with just 10 companies selected to bring their technology to life at the heart of the congress. 

There will be four tracks at the event: connected consumer and digital brand experience; product trust, authentication, compliance and digital product passports; connected products, RFID and supply chain intelligence; and AI, data and the future of intelligent packaging.