HP Indigo and BASF collaborate for development of water-based adhesives

HP Indigo and BASF have entered into a strategic collaboration for the development of water-based adhesive products for flexible packaging.

HP Indigo and BASF have entered into a strategic collaboration for the development of water-based adhesive products for flexible packaging, such as that produced on the HP Indigo 20000 digital press

These products will be tailored to the requirements of the HP Indigo ElectroInk process.

BASF’s water-based adhesive systems are an environmentally compatible alternative to conventional technologies when it comes to the lamination of flexible food packaging, the company declared. Epotal lamination systems, for example, offer advantages over solvent and solventless adhesives. Beside a lower carbon footprint, these systems provide increased flexibility and accelerated production procedures due to a unique polymer design.

Nurit Raccah, labels and packaging media and materials business manager within the Indigo division of HP, said: ‘HP is constantly looking into faster turnaround time to extend the value of the digital printing applications. This strategic collaboration with BASF, a leading player in the adhesive industry, demonstrates our continued commitment to providing HP Indigo customers full end-to-end solutions with extended performance.’

The expansion of HP Indigo digital printing into mainstream flexible packaging required validation of various adhesive performances with the HP Indigo ElectroInk process. Thus, BASF accomplished several lamination options for digital printing, including adhesives for dry lamination for food packaging. This includes the high-performance water-based adhesives for digital inks, Epotal DP3820X and Basonat LR 9056.

Dr Axel Weiss, head of marketing of dispersions, Industrial Adhesives Europe at BASF, commented: ‘In combination with HP Indigo Pack Ready Coating, these adhesives enable the production of retort pouches with best lamination quality.’

Samples will be displayed at the booths of BASF (hall 10, B43) and HP (hall 13, C77) at interpack 2017.

Read an update on the digital flexible packaging printing market in L&L issue 3, 2017